Wafer Coring - Tips for Dicing Silicon Wafers

Wafer coring is the process of cutting a silicon wafer into pieces. This is a critical step in the manufacturing process because it determines the size of the finished product. To learn more about the process and the tools needed, read this article. It will also discuss the critical factors that must be considered during the dicing process. This article also describes about the wafer coring services and typical results of dicing silicon wafers. It will also explain how the process is compared to other dicing processes.

Process of dicing silicon wafers

Dicing is an intricate and highly specialized process that produces squares, rectangles, and straight lines from a silicon wafer. The width of each dice street will depend on the blade diameter and thickness. The resulting squares or rectangles are generally between 0.1 and 35 mm wide. There are many variables that must be precisely controlled for this process to ensure quality. Here are some tips that you should remember when dicing silicon.

The process of dicing involves the use of a high-speed rotating disc with a thin diamond blade. This method is effective in cutting wafers but is prone to chipping and cracking. This results in lower yields and a damaged product. Blade dicing is the preferred method for cutting semiconductor wafers, but is more costly than other methods. This article discusses the different methods of dicing silicon wafers.

Tooling used in the dicing process

The wafer dicing process involves a series of steps to make a finished product. The first step is depositing a layer of KE resist on a wafer. This layer is patterned with a KE mask. Other steps in the process include performing a photolithographic process and selectively removing the photoresist. The resulting product will be a finished semiconductor.

A tape-based system requires a mounting system. It is important to choose a tape that is designed specifically for the material being sliced. Two models of wafer/film frame tape applicators are available from Semiconductor Equipment Corporation, one of which is a high-volume automatic system. Another model, the Advanced Dicing Technologies 966 Wafer Mounter, has a circular blade that cuts the excess tape. Another company that makes dicing tapes is Disco Corporation.

Another advantage of a new laser-based dicing system is that it eliminates the need for multiple etching passes, which saves on a laser's cost and energy. In addition, because the lasers are more precise, it allows for a lower kerf width than in traditional dicing processes. It also reduces the number of laser pulse passes required. ADT's system can be customized to meet the needs of your unique dicing process.

Critical factors to consider in the dicing process

A dicing system's performance is affected by several variables. Understanding these variables will help end users choose the right dicing blade and optimize cutting operations. Changing just one variable will not create efficiency. All the variables must be carefully considered and selected to achieve the desired end result. Incorrect selection of a single variable can affect all of the others. Hence, it is vital to select the right dicing process for your application.

First, dicing blades should be of a suitable thickness and material. Blades that are too thin are prone to premature breakage and wear. Furthermore, films and TEGs on the front side of the wafer can interfere with the cutting process, compromising processing quality on the backside. The recommended blade thickness is 20 to 30 um. The blade's width and the required processing capability factor are two other factors to consider.

Typical results of dicing silicon wafers

A high-yield dicing process is dependent on the precision and control of the cutting blade. Typically, the feed rate can be between 70 um and 100 um, but a process that produces smaller street widths needs to be much more precise. To improve the accuracy of the process, the feed rate should be monitored through special monitoring tools, such as optical magnification. The feed rate can also be controlled by adjusting the feed rate and blade torque.

A laser-guided process is a gentle, non-contact dicing technique that is especially suitable for thin silicon wafers. It reduces the chance of her loss and contamination, which are important for chip yield. Typically, dicing a silicon wafer with a laser yields a chip with a kerf width of less than 30 mm. This process also allows for flexibility in die arrangement, as different die sizes can be placed on the same wafer.